FYI: HOT CHIPS SYMPOSIUM V: ADVANCE PROGRAM

[Dave Farber <farber () central cis upenn edu>]

            Just When You thought It Was Safe To Go On Vacation
 
                         HOT CHIPS SYMPOSIUM V
                  A Symposium on High-Performance Chips
                           (Advance Program)
 
                 Sponsored by the IEEE Computer Society
                 Technical Committee on Microprocessors

               Stanford University, Palo, Alto, California
                          Memorial Auditorium
                           August 8-10, 1993

Attend HOT Chips V, a symposium on high-performance chips, which will bring
together researchers and developers of chips used to construct high-
performance
workstations and systems. Enjoy the informal format offering interaction with
speakers. The first four HOT Chips Symposiums were huge successes and prompted
articles in four special issues of IEEE Micro magazine. This year's HOT Chips 
V will again bring you the latest developments in chip technology.

ORGANIZING COMMITTEE

General Chairman:            John Hennessy,   Stanford University
Program Co-Chairmen:         Ruby Lee,        Hewlett-Packard
                             Teresa Meng,     Stanford University
Finance Chairman:            Martin Freeman,  Philips Research
Registration Chairman:       Robert Stewart,  Stewart Research
Publication Chairman:        Nam Ling,        Santa Clara University
Publicity Chairman:          Andre Goforth,   NASA Ames Research Center
Local Arrangements Chairmen: Robert Stewart,  Stewart Research
                             Cary Kornfeld,   Interval Research
At Large:                    Hasan AlKhatib,  Santa Clara University
                             Glen Langdon,    UC Santa Cruz
                             Alan J. Smith,   UC Berkeley


PROGRAM COMMITTEE

Donald Alpert,   Intel Corp.
Robert Garner,   Sun Microsystems
Ruby Lee,        Hewlett Packard (Program Co-Chair)
John Mashey,     Silicon Graphics
Teresa Meng,     Stanford University (Program Co-Chair)
Peter Ruetz,     SiArc
Alan J. Smith,   UC Berkeley


PROGRAM


August 9, 1993


8:45-9:00   Welcome and Opening Remarks
            John Hennessy, General Chair
            Ruby Lee and Teresa Meng, Program Co-Chairs

9:00-11:00  Session 1: High Integration
            Session Chair: Ruby Lee, Hewlett-Packard Co.

            . DECchip 21066 - Alpha AXP Architecture Processor for 
              Low-Cost Applications
              Mark Rosenbluth, Digital Equipment Corp.

            . ICE: A high-performance MIPS microprocessor for portables
              Barbara Zivkov, MIPS Technologies Inc.

            . Hummingbird: A Low-Cost Superscalar PA-RISC Processor
              Stephen R. Undy, et al, Hewlett-Packard Co.

            . Optimized PentiumTM Processor 82430 PCIset for High 
              Performance Local Bus Designs
              Dale Jorgensen, Intel Corp.

11:00-11:30  Break

11:30-12:30 Session 2: Portable Communications
            Session Chair: Teresa Meng, Stanford University

            . An Integrated Solution to CT2 Digital Cordless Telephones
              David Norris, Alan Hendrickson, Advanced Micro Devices

            . CDMA Mobile Station Modem ASIC
              Timothy Rueth, Qualcomm Incorporated

12:30-2:00  Lunch

2:00-3:30   Session 3: Glowing Hot Chips
            Session Chair: John Mashey, Silicon Graphics, Inc.

            . A 300MHz 115W 32b Bipolar ECL Microprocessor with 
              On-chip Caches
              Norman P. Jouppi, et al, DEC Western Research Lab

            . The Aurora Project
              Mike Upton, Tom Huff, Trevor Mudge, Rich Brown, 
              University of Michigan

            . MasPar MP-2 PE Chip: A Totally Cool Hot Chip
              Won Kim and Russ Tuck, MasPar Computer Corp.

3:30-4:00  Break

4:00-5:30  Session 4: Graphics Processors
           Session Chair: Robert Garner, Sun Microsystems, Inc.

           . Compact 3D Graphics Chip Set
             Michael Deering, Sun Microsystems

           . A Single-Chip Workstation Graphics System
             Larry J. Thayer, Hewlett-Packard Co.

           . A 200 Mpixels/sec Graphics Accelerator with Multimedia 
             Expansion
             Jacques Martinella, Weitek Corporation

5:30-7:00  Reception Dinner

7:15-9:30  Evening Panel Session

           Compelling Applications for Computing in the Year 2000
           Moderator: David Liddle, Interval Research



August 10, 1993

9:00-11:00: Session 5: Video Processors
            Session Chair: Peter Ruetz, SiArc

            . A Single Chip Multistandard Video Codec
              Subroto Bose, Steve Purcell & Tony Chiang, C-Cube 
              Microsystems

            . The Multiprocessor Video Processor, MVP
              Karl Guttag, Texas Instruments
 
            . A Family of MPEG Video Encoder and Decoder Chips 
              Optimized for Consumer Applications
              Martin Bolton, SGS-Thomson Microelectronics, France

11:00-11:30: Break

11:30-12:30: Session 6: Design Validation
             Session Chair: Donald Alpert, Intel Corp. 

             . Pre-Silicon Validation of Pentium(TM) CPU
               Azam Barkatullah, Wern-Yan Koe, Harish Nayak, 
               Nazar Zaidi, Intel Corp.

             . System Design Verification of the HP735 VLSI
               Gregory Burroughs & Alan Wiemann, Hewlett-Packard Co.

12:30-2:00:  Lunch

2:00-3:30:  Session 7: New Technology
            Session Chair: Teresa Meng, Stanford University

            . AMULET1 - An Asynchronous ARM Processor
              S. B. Furber, University of Manchester, UK

            . Pushing The Limits of CMOS Technology: A Wave-Pipelined
              Multiplier
              Fabian Klass and Michael Flynn, Stanford University

            . A 40,000 Pattern/s Classification Coprocessor with 
              Learning Capability
              Mark A. Holler, et al, Intel Corp.

            . Stanford Ultra Low Power CMOS
              Jim Burr, Stanford University

3:30-4:00: Break

4:00-5:30: Session 8: High Performance Processors
           Session Chair: Alan Smith, UC Berkeley

           . A 120 MHz Superscalar PA-RISC Processor
             Kenji Matsubara, Hitachi, Ltd., Japan

           . 601 PowerPC Microprocessor
             David Mothersole, Motorola, Inc.

           . Silicon Graphics TFP Micro-Supercomputer Chipset
             Peter Yan-Tek Hsu, Silicon Graphics Computer Systems


5:30       Closing Remarks


SUNDAY, AUGUST 8 --- TUTORIALS 


CACHE MEMORIES: Alan J. Smith, UC Berkeley

This tutorial will survey the design and design considerations for
cache memories. Specific topics discussed will include: fetch,
placement, and replacement algorithms, line size, cache size,
store through vs. copy back updating of memory, cold start vs.
warm start miss ratios, multicache consistency, virtual address
caches, user/supervisor caches, split instruction/data caches,
multilevel caches, tranlation lookaside buffers, and the effect of
I/O through the cache.

DRAM CHOICES FOR THE 1990s: Steven Przybylski, Consultant

This tutorial will summarize the stengths and weaknesses of each of
the emerging DRAM alternatives: Synchronous DRAM, Cache DRAM,
Enhanced DRAM, Rambus DRAM, and Ramlink DRAM. The discussion will
show which DRAM markets will be best served by each architecture,
why these changes are occurring now, and what further changes can
be expected as the industry moves toward the 64M bit level and
beyond.


Hot Chips V offers you two tutorials and a luncheon for one low fee
of only $15. The tutorials will be in Memorial Auditorium. The Cache
Memories tutorial will be held from 8:30 AM until noon. DRAM Choices
for the 1990s is scheduled for 1:00-4:30 PM. The Wine and Cheese 
Reception follows immediately afterward at 4:30 PM in Dohrmann Garden
just north of the Hoover Tower on Serra Street.



HOUSING INFORMATION

Housing is available on the Stanford University campus in student
dormatories which are vacant in the summer. These have central lavatory
facilities and cost about $40 per night --- single, $50 per night ---
double, for the nights of the symposium. A key deposit of $50 is
required that will be refunded at checkout. Housing arrangements on the
Stanford campus must be made by August 1 through HOT Chips, not
Stanford.

Housing is also available at numerous hotels and motels on the
peninsula in Palo Alto, Menlo Park, Mountain View, and Los Altos within
5 miles of the campus. You are responsible for making such reservations
directly with the motel.

If you would like additional housing information, please check the housing
information request box on the registration form.

IEEE/Computer Society Membership

To join call John Gill at (202) 371-0101. With confirmation, you may 
register for HOT Chips V at member rates.

Half year rates: IEEE      ---  $63.50
Computer Society Affiliate ---  $29


QUESTIONS?

For more information on registration and local arrangements contact Dr.
Robert Stewart at (415) 941-6699 or Robert Stewart at (415) 941-6699 or r.stewart () compmail com.


REGISTRATION INCLUDES:

* Attendance                       * Sunday Evening Wine & 
* One Copy of the Notes              Cheese Reception
* Two Luncheons                    * Monday Evening Reception
* Coffee Breaks                    * Parking

A Stanford map, parking permit, the location of parking, and a receipt
will be mailed to early registrants.

ON-SITE REGISTRATION is available Sunday morning before the tutorial,
at the wine and cheese reception, and each morning at the Symposium.
Early advanced registration is recommended because of the large
attendance.

LARGE GROUP discount are available.

CANCELLATION OF REGISTRATION: Must be made in writing prior to Sunday,
August 1, 1993. A $40 fee will be charged for cancellation.

FEDERAL TAX ID NUMBER IS: 13-1656633 for the

Institute of Electrical & Electronic Engineers
345 E. 47th Street
New York, NY  10017

QUICK VERIFICATION OF REGISTRATION will be made for an extra fee of $10.
A suggested alternative method is to mail your registration and purchase
"Return Receipt Requested" at the Post Office.

 
=============================================================================


                      HOT CHIPS V REGISTRATION FORM


Name________________________________________________________________________

Organization________________________________________________________________

Dept/Mail Stop______________________________________________________________

Mailing Address_____________________________________________________________

City/State/Zip______________________________________________________________

Country_____________________________________________________________________

Area Code/Phone #___________________________________________________________

Email Address_______________________________________________________________

Membership:       IEEE/CS______          ACM_______

                  Student______          None______

Society Membership Number___________________________________________________

Check One:

______Check drawn on a U.S. Bank                    ______MasterCard
      Make Check Payable To:
      Hot Chips Symposium                           ______VISA

Name on Credit Card_________________________________________________________

Credit Card #_______________________________________________________________

Expiration Date_____________________________________________________________

Signature___________________________________________________________________
 


FEES: CIRCLE APPROPRIATE VALUES

                             Before July 15            After July 15

IEEE/Computer Society            $170                       $240
or ACM Member

Non-Member                       $240                       $290

Student Member                   $60                        $100

Sunday Tutorials                 $15                        $15

Extra Copy of Notebook           $30                        $30
(with no mailing)

Quick Registration               $10                        $10
Verification


Stanford University Dormitory Housing $ _________ 
______ nights @$40 per night single; $50 double.



TOTAL AMOUNT PAID               ______________



VISA or Mastercard Registration To:


FAX:    (415) 941-5048
EMAIL:  r.stewart () compmail com



Surface Mail Registration To:

                        Dr. Robert G. Stewart
                        Stewart Research Enterprises
                        1658 Belvoir Drive
                        Los Altos, CA  94024



Do NOT put me on the Hot Chips Mailing List                    _____

Quick Verification of registration is wanted for a fee of $10  _____

Stanford University Housing Information Requested              _____

------ End of Forwarded Message